Applied Materials SEMVision CX DR-300

Wafer Specification

Wafer Size: Can be configured upon request to 200mm or 300mm
Wafer Shape: Notch

Electron Optical System

Acceleration Voltage: 150V - 15000V
Probe Current: 10pA - 1.2nA
SEM Resolution: 4nm @1KV
Magnification: X200 - X200000
Maximum Pixel: 1440
MPSI (Multi Perspective SEM Imaging): Yes
VC Model (Voltage Contrast): Yes

Optical Microscope System

Bright Light Microscope: Yes
Dark Field Microscope: Yes
5X, 20X and 100X Objectives

SECS/GEM Communication Interface

Defect File Format: Functionality Confirmed to KLARF
Output File Format: Same as Input Format
Host Communication (SECS II / GEM /HSMS): Yes

Wafer Stage

Stage Accuracy: ±1.5um
Unique Die-to-Die: Yes
Single Image ADR (Automatic Defect Review): Yes
ADC (Automatic Defect Classification): Yes
Un-Pattern Review: Yes
API (Automatic Process Inspection): Yes
E-Chuck Stage: No (Pins Stage)
Anti Charge-3 (E-SEM): Yes

Peripherals

Port 1 Type: OCLP
Port 2 Type: OCLP
EDX: Yes
Tilt and Rotation: Yes
Remote Work Station: Yes
Resolution Target: Regular
Signal Tower: Standard
EPDU: Yes
FIB: No