Applied Materials SEMVision CX DR-300
Wafer Specification
- Wafer Size: Can be configured upon request to 200mm or 300mm
- Wafer Shape: Notch
Electron Optical System
- Acceleration Voltage: 150V - 15000V
- Probe Current: 10pA - 1.2nA
- SEM Resolution: 4nm @1KV
- Magnification: X200 - X200000
- Maximum Pixel: 1440
- MPSI (Multi Perspective SEM Imaging): Yes
- VC Model (Voltage Contrast): Yes
Optical Microscope System
- Bright Light Microscope: Yes
- Dark Field Microscope: Yes
- 5X, 20X and 100X Objectives
SECS/GEM Communication Interface
- Defect File Format: Functionality Confirmed to KLARF
- Output File Format: Same as Input Format
- Host Communication (SECS II / GEM /HSMS): Yes
Wafer Stage
- Stage Accuracy: ±1.5um
- Unique Die-to-Die: Yes
- Single Image ADR (Automatic Defect Review): Yes
- ADC (Automatic Defect Classification): Yes
- Un-Pattern Review: Yes
- API (Automatic Process Inspection): Yes
- E-Chuck Stage: No (Pins Stage)
- Anti Charge-3 (E-SEM): Yes
Peripherals
- Port 1 Type: OCLP
- Port 2 Type: OCLP
- EDX: Yes
- Tilt and Rotation: Yes
- Remote Work Station: Yes
- Resolution Target: Regular
- Signal Tower: Standard
- EPDU: Yes
- FIB: No