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Applied Materials (AMAT) VeraSEM 3D Automated CD Metrology System
$9,999,999.00
Wafer Specification
Wafer Size: 200MM
Wafer Shape: SNNF (Semi Notch No Flat)
Wafer Cassette: 8” PP Miraial
Electron Optical System
Electron Gun Schottky emission source (fei)
Accelerating voltage 300V to 2000V
Probe Current Low 5pA / Medium 10pA / High 20pA
Electromagnetic Lens 3 Stage Electromagnetic Lens
System with boosting voltage Beam Deflector Module
Objective Lens
Scan Coil 2-Stage Electromagnetic Deflection (X- and Y-Axes)
Magnification 1,000x to 400,000x (100um to 0.25um FOV)
Wafer imaging ability Entire surface of 8” wafer
Asspect Ratio >14 : 1
Tilt Function 5 degrees (4 Direction)
Resolution 3nm (500V)
Optical Microscope System
Camera Monochrome, using CCD camera (Producted by COHU)
Magnification 16x / 220x (450um / 6000um FOV)
Wafer imaging ability Entire surface 8” wafer
SECS/GEM Communication Interface
Automated Image Archiving Function Always / Online Setup / Never
Measurement Function Average/Maximum/Minimum/Contact Hole/
Line Edge Analysis/CH Analysis/Slope
Measurement Algorithm Normal / Foot / Threshold
Wafer Stage
Wafer Stage Anorad XY and Z Stage
Moving Speed 300mm/sec
Function Target Faraday cup / Resolution Target
Wafer Transfer
Wafer Shape ability Notch / Orientation Flat
Pre-alignment Sensing by CCD BAR (200mm wafer)
External Power Distribution Unit
Fun Filter Unit
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Call us at
(800) 608-4834
for Price and Availability