Applied Materials (AMAT) VeraSEM 3D Automated CD Metrology System
$9,999,999.00
Wafer Specification
- Wafer Size: 200MM
- Wafer Shape: SNNF (Semi Notch No Flat)
- Wafer Cassette: 8” PP Miraial
- Electron Gun Schottky emission source (fei)
- Accelerating voltage 300V to 2000V
- Probe Current Low 5pA / Medium 10pA / High 20pA
- Electromagnetic Lens 3 Stage Electromagnetic Lens
- System with boosting voltage Beam Deflector Module
- Scan Coil 2-Stage Electromagnetic Deflection (X- and Y-Axes)
- Magnification 1,000x to 400,000x (100um to 0.25um FOV)
- Wafer imaging ability Entire surface of 8” wafer
- Asspect Ratio >14 : 1
- Tilt Function 5 degrees (4 Direction)
- Resolution 3nm (500V)
- Camera Monochrome, using CCD camera (Producted by COHU)
- Magnification 16x / 220x (450um / 6000um FOV)
- Wafer imaging ability Entire surface 8” wafer
- Automated Image Archiving Function Always / Online Setup / Never
- Measurement Function Average/Maximum/Minimum/Contact Hole/
- Line Edge Analysis/CH Analysis/Slope
- Measurement Algorithm Normal / Foot / Threshold
- Wafer Stage Anorad XY and Z Stage
- Moving Speed 300mm/sec
- Function Target Faraday cup / Resolution Target
- Wafer Shape ability Notch / Orientation Flat
- Pre-alignment Sensing by CCD BAR (200mm wafer)
- External Power Distribution Unit
- Fun Filter Unit