Applied Materials (AMAT) VeraSEM 3D Automated CD Metrology System

Wafer Specification
  • Wafer Size: 200MM
  • Wafer Shape: SNNF (Semi Notch No Flat)
  • Wafer Cassette: 8” PP Miraial
Electron Optical System
  • Electron Gun Schottky emission source (fei)
  • Accelerating voltage 300V to 2000V
  • Probe Current Low 5pA / Medium 10pA / High 20pA
  • Electromagnetic Lens 3 Stage Electromagnetic Lens
  • System with boosting voltage Beam Deflector Module
Objective Lens
  • Scan Coil 2-Stage Electromagnetic Deflection (X- and Y-Axes)
  • Magnification 1,000x to 400,000x (100um to 0.25um FOV)
  • Wafer imaging ability Entire surface of 8” wafer
  • Asspect Ratio >14 : 1
  • Tilt Function 5 degrees (4 Direction)
  • Resolution 3nm (500V)
Optical Microscope System
  • Camera Monochrome, using CCD camera (Producted by COHU)
  • Magnification 16x / 220x (450um / 6000um FOV)
  • Wafer imaging ability Entire surface 8” wafer
SECS/GEM Communication Interface
  • Automated Image Archiving Function Always / Online Setup / Never
  • Measurement Function Average/Maximum/Minimum/Contact Hole/
  • Line Edge Analysis/CH Analysis/Slope
  • Measurement Algorithm Normal / Foot / Threshold
Wafer Stage
  • Wafer Stage Anorad XY and Z Stage
  • Moving Speed 300mm/sec
  • Function Target Faraday cup / Resolution Target
Wafer Transfer
  • Wafer Shape ability Notch / Orientation Flat
  • Pre-alignment Sensing by CCD BAR (200mm wafer)
  • External Power Distribution Unit
  • Fun Filter Unit

    Call us at (800) 608-4834 for Price and Availability