Automatic Defect Classification for Yield Optimization
Enhancing defect identification and critical dimension control to accelerate yield learning and boost manufacturing efficiency
Automatic Defect Classification (ADC) plays a vital role in semiconductor manufacturing by using optical or SEM-based techniques to identify and characterize defects that negatively impact yield. The concept of “Yield Pro” reflects the industry’s ongoing pursuit of maximizing functional chips per wafer, and ADC accelerates this by delivering faster and more accurate defect classification—resulting in quicker yield learning and more effective defect management.

Above image demonstrates 4 classes and ready to load set of images to classify.

