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Since 2012, GTi has been providing Inspection and Metrology solutions for Applied Materials® platforms, delivering fully remanufactured systems, boasting an extensive inventory of ready-to-ship spare parts, and delivering expert service and applications support worldwide

GTi

Green Technology Investments LLC, (GTi), headquartered in Scottsdate, Arizona has announced the formation of two new companies which will operate under the GTi Umbrella: METREX and RT Experts (RT-EX). These new companies aim to revolutionize the semiconductor industry through innovative remanufacturing and software solutions.

METREX™

GTi - now know as METREX™ - has been providing metrology solutions for Applied Materials® platforms since 2012. They remanufacture AMAT CD-SEM and DR-SEM metrology systems, offering high-quality equipment at a significant cost and lead time savings over that of new systems. They also have an extensive inventory of ready-to-ship spare parts and provide expert service support and foundry capabilities.
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RT Experts™

RT Experts™ (RT-EX) specializes in remanufacturing semiconductor MASK systems, enabling customers to access advanced technology at a more affordable price point.
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Offices

GTi is well-positioned to serve the needs of customers worldwide, with offices in North America, Europe, and Asia. Their goal is to make cutting-edge technology more accessible to businesses of all sizes and locations. With the launch of METREX and RT Rxperts (RT-EX), GTi is one step close to achieving that goal. We look forward to seeing the impact these companies have on the semiconductor industry.

etrology®

GTi exclusive reseller for Etrology Software Innovations
etrology® - the revolutionary solution that offers you unparalleled freedom in measurement and inspection tasks!
etrology® Provides Innovative Solutions in Test & Measurement, Process & Machine, Data Logging And Automation
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OUR SOLUTIONS

SYSTEMS

SEMVision Defect Review
VeritySEM Critical Dimension
WF | Compass | Complus Darkfield Inspection

SPARES

Over 60,000 parts in stock
Consumables and non-consumables
Legacy+Obsolesence upgrades
RS170 camera upgrade for all CD SEMS

SERVICE

Hardware and Application support
Level 5 FSE's
Flexible service support contracts
Size conversions + Chamber additions

TRAINING

Basic tool operation, equipment tasks,
and troubleshooting
Advanced Applications for improved theoretical and operational knowledge

FOUNDRY

150-300mm wafers
Special Wafer thicknesses
Exotic materials
Calibration wafers

DEMO

State-of-the-art
Special Wafer thicknesses
Exotic materials
Calibration wafers

Our Solutions

AMAT SEMVision G3

ADVANCED DEMO LAB

State-of-the-art, fully calibrated metrology equipment 

Currently running customer products for evaluation and development

COMPLETE SYSTEM SALES

SEMVision Defect Review

VeritySEM CDSEM

WF | Compass | Complus Darkfield Inspection

TRAINING OFFERINGS

Basic tool operation, equipment tasks, and troubleshooting

Advanced Applications for improved theoretical and operational knowledge

SERVICE EXPERTS

Hardware and
Application support

Level 5 FSE’s

Flexible service support contracts

SPARE
PARTS

Over 60,000 parts in stock

Legacy + Obsolescence upgrades

OBSOLESCENCE MITIGATION

Legacy + Obsolescence upgrades

RS170 upgrades for all CD-SEMs

Size conversions +
chamber additions

innovation
system
training
support
parts
solutions

MAIN ACTIVITIES

DEFECT REVIEW

Applied Materials®, Inc. has introduced the SEMVision DR-SEM system, a fully-automated defect review and classification scanning electron microscope specifically designed for in-line operation on advanced semiconductor production lines. The system uses several SEM imaging and material analysis techniques to improve chipmakers’ yield earning cycles during fab ramp-up and enables tighter yield control in volume production.​

CRITICAL DIMENSION

The Applied Materials®, Inc. VeraSEM family of system’s exceptional in-line accuracy and process control eliminate more time-consuming and costly off-line wafer cross-sectioning while helping chipmakers to streamline process development, improve device performance and yield, and shorten ramp times to high-volume production.

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