VERASEM 3D

*Multiple Systems Available
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nm
Resolution
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°
Tilt Function
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X
Magnification

The VeraSEM 3D system’s exceptional in-line accuracy and process control eliminate more time-consuming and costly off-line wafer cross-sectioning while helping chipmakers to streamline process development, improve device performance and yield, and shorten ramp times to high-volume production.

  • Wafer Size: 200MM
  • Wafer Shape: SNNF (Semi Notch No Flat)
  • Wafer : 6”, 8” or 12”
  • - Electron Gun Schottky emission source (fei)
  • - Accelerating voltage 300V to 2000V
  • - Probe Current Low 5pA / Medium 10pA / High 20pA
  • - Electromagnetic Lens 3 Stage Electromagnetic Lens
  • - System with boosting voltage Beam Deflector Module
  • - Scan Coil 2-Stage Electromagnetic Deflection (X- and Y-Axes)
  • - Magnification 1,000x to 400,000x (100um to 0.25um FOV)
  • - Wafer imaging ability Entire surface of 8” wafer
  • - Aspect Ratio >14 : 1
  • - Tilt Function 5 degrees (4 Direction)
  • - Resolution 3nm (500V)
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Automated Image Archiving Function Always / Online Setup / Never

Measurement Function Average/Maximum/Minimum/Contact Hole/

Line Edge Analysis/CH Analysis/Slope

Measurement Algorithm Normal / Foot / Threshold

 

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