SEMVISION G4/G5

*EDX, Tilt and MAX™ Upgrade Available
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nm
Resolution at 1 KeV
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Wafers per hour
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Defects per hour
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EDX Resolution

Applied SEMVision™ family, the industry’s fastest, most sensitive line of defect review and analysis tools for 65/45nm manufacturing and beyond. The new line of three systems sets the industry benchmark with 30nm sensitivity and throughputs of up to 2,400 defects per hour. Used in an optimized defect review strategy, these systems can accelerate customers’ production ramp by rapidly identifying the root cause of systematic and yield-limiting defects.

The SEMVision product line includes the Applied SEMVision G4  tool, the most productive system available for performing routine defect review and production process monitoring. The G4 and G5 provide a significant reduction in cost of ownership over previous tools, achieving world-class efficiency and lowest cost per defect.

The Applied SEMVision G4 and G5 are the production workhorse systems for volume defect review and material analysis, offering tilt and EDX capabilities. 

All systems share the same proven platform, including the capability to share recipes, a common user interface and algorithms. This unique commonality shortens set-up time through extensive recipe sharing and provides high availability. 

Applied's SEMVision technology, which features industry innovations such as multi-perspective imaging and materials analysis has rapidly expanded the use of SEMs (for defect analysis in manufacturing). The need for defect review has greatly increased and is now the third largest segment in the defect reduction market. Green Technology Investments®, with an install base of nearly 100 SEMVision systems, is a leading supplier of this technology. 

The new SEMVision family addresses the trend to achieve faster time to Resolution by harnessing the combined power of process and inspection expertise to dramatically cut the time and cost of resolving yield-limiting defects. 

 

  • Model: AMAT SEMVision G4
  • Description: Defect Review System
  • Wafer Size: 300mm
  • Warranty: As Is or Refurbished to Customer Spec
  • LoadPort Type: 2 Loadports with FOUP Capability
    • Loadport Maker: TDK

    • Carrier Reader: RFID type

Robot Maker: Brooks

Sight Source: SE-Gun Tip

Resolution: 4.0nm

  • 1. Optical Microscope
    2. Automatic Defect Review
    3. Automatic Defect Classification 4. Site Inspection
    5. Automatic Defect Localization 6. Beam Tilt
    7. EDX

  • 1. Main Unit
    2. Operator Console 3. UPS
    4. EPDU
    5. FFU
    6. Tool Cover
    7. Isolation Block

Loader: AMAT ADO with RFID / OCLP / SMIF

Wafer Size: 300mm / 200mm

FFU with ULPA Filter

SEM column

EDX column

45 Deg column Tilt

Wafer Rotation option included

Stage wafer holder ESC 

ETU 300mm / 200mm

ITU 300mm / 200mm

Aligner

Optical Microscope X5 ,X20, X100

Software version

WS, IP/ODC SW, MEC, WHC): v5.4.500( latest version)

WorkStation SGI FULE

Software version (EDX): VTG_5.4.500 (latest  version)

TFT LCD Monitors

IPU G3/G2 

Pal (On the OTW, cassette / Slot 1: Delta X= 500 µms; Delta Y= 500 µm

ITU Repeatability: Delta X and Delta Y < 20 µm

Stage accuracy: Delta X and Delta Y < 1,5 µm

MTR: Delta X= 50; Delta Y= 30 µms

 

Focus map / focus offset: 90% of the defect with Delta Z < 3 µms

Automatic defect offset/XY Map: 95% of the defects with Delta X < 1.5 µm and Delta Y < 1.5 µm

EDX resolution 4nm 

Wafer throughput: 15 Wafers / Hours

Defects throughput: >1800 Defects / Hour

Cleanliness front side: 

0.013 PWP / cm2 > size at 0.2 µm

Largest load ampere rating: 8 A

Full load current: 10 A

Interrupt current: 10,000 Amps I. C.

Supply voltage: 1-120 VAC, 1-Ph, 3-wires

208 V, 3-Ph, 5-wires, 50/60 Hz

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