SEMVISION G2

The SEMVision G2’s detection assembly and processing make possible high-quality topographical images of tiny and shallow defects. High dynamic range detection, collection of back-scattered electrons, and energy filtering enable high aspect ratio imaging.

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nm
Resolution at 1 KeV
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Wafers per hour
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Defects per hour
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nm
EDX Resolution
  • Model: AMAT SEMVision G2+
  • Description: Defect Review System
  • Wafer Size: 300mm
  • Serial Number: Multiple Systems Available
  • Warranty: As Is or Refurbished to Customer Spec
  • Resolution at 1 KeV: 3 nm
  • Focus map / focus offset: 90% of the defect with Delta Z < 3 μms
  • Automatic defect offset/XY Map: 95% of the defects with Delta X < 1.5 μm and Delta Y < 1.5 μm
  • EDX resolution: 4nm
  • Wafer throughput: 12 Wafers / Hours
  • Defects throughput: >1000 Defects / Hour
  • Cleanliness front side: 0.013 PWP / cm2 > size at 0.2 μm
  • - FFU with ULPA Filter
  • - SEM Column G2
  • - EDX Column
  • - 45 Deg Column Tilt
  • - Wafer Rotation option included
  • - Stage wafer holder 3 PIN
  • - Aligner Optical Microscope X5, X20, X100
  • Loader: AMAT ADO with RFID
  • Wafer Size: 300mm
  • ETU 300mm
  • ITU 300mm
  • Software version (WS, IP/ODC SW, MEC, WHC): v5.1.500 WorkStation SGI FULE
  • Software version (EDX): VTG_5.0.107
  • Pal (On the OTW, cassette / Slot 1: Delta X= 500 μm; Delta Y= 500 μm
  • ITU Repeatability: Delta X and Delta Y < 20 μm
  • Stage accuracy: Delta X and Delta Y < 1.5 μm
  • MTR: Delta X= 50; Delta Y= 30 μm
  • Largest load ampere rating: 8 A
  • Full load current: 10 A
  • Interrupt current: 10,000 Amps I. C.
  • Supply voltage: 1-120 VAC, 1-Ph, 3-wires 208 V, 3-Ph, 5-wires, 50/60 Hz

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