CD-SEM
CRITICAL DIMENSION
CRITICAL DIMENSION
VERITY NEXTGEN
Compound Semiconductor | Advanced Packaging | HVM-High Volume Measurement
Compound Semiconductor Substrates, Glass, SiC
KEY FEATURES:
- Optimized for Compound Semiconductor Applications
- Advanced Packaging Compatibility
- Flexible Wafer Handling
- Supported wafer sizes: (150/200/300 mm)
PRODUCT LINEUP
CD-SEM | Critical Dimension
VeraSEM 3D
*Multiple Systems Available
NanoSEM 3D
*Defect Analysis System
VeritySEM®
*Defect Analysis System
VeritySEM®II
*Multiple Systems Available
VeritySEM®III
*Multiple Systems Available
VeritySEM®NextGEN
*Defect Analysis System
VeritySEM®4i (4i+)
*Defect Analysis System
VeritySEM®5i
*Multiple Systems Available
SUBMIT REQUEST FOR A QUOTE or INFO
QUICK LINKS
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CONTACT
EMAIL: sales@gt3i.com
PHONE: 480-400-6910
PHONE: 800-608-4834
LOCATION: 15936 N 78th St
Scottsdale, AZ 85260
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