DR SEM (with or without FIB)

With our Z-stage, you have the ability to process wafers of varying thicknesses, up to 2mm.

Compound Semi Conductor | Advanced Packaging | HVM-High Volume Measurement

KEY FEATURES:

• Optimized for Compound Semiconductor Applications
• Advanced Packaging Compatibility
• Flexible Wafer Handling
• Supported wafer sizes: (150/200/300 mm)

PRODUCT LINEUP
DR-SEM | Defect Review

SUBMIT REQUEST FOR A QUOTE or INFO